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ASUS PRIME Z790M-PLUS D4 Motherboard
ASUS Prime series motherboards are expertly engineered to unleash the full potential of 13t Gen Intel Core Processors. Boasting a robust power design, comprehensive cooling solutions and intelligent tuning options, PRIME Z790M-PLUS D4 provides users and PC DIY builders with a range of performance optimizations via intuitive software and firmware features.
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Intel LGA 1700 socket: Ready for 12th and 13th Gen Intel processors
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Enhanced power solution: 16+1 DrMOS, ProCool connectors, chokes and durable capacitors for stable power delivery
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Comprehensive cooling: Large VRM heatsinks, M.2 heatsinks, hybrid fan headers and Fan Xpert 4
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Next-gen connectivity: DDR5 memory, PCIe 5.0, Intel 2.5 Gb Ethernet, USB 3.2 Gen2x2 Type-C, front panel USB 3.2 Gen 2 Type-C, Thunderbolt (USB4) header support, 4 PCIe 4.0 M.2
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Exclusive AI & Memory technology: AI Cooling II, Two-Way AI Noise-Cancelation, ASUS Enhanced Memory Profile II and ASUS OptiMem II
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PC DIY design: PCIe Slot Q-Release, M.2 Q-Latch, Q-LED Core, and SafeSlot
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AI Cooling llAI Cooling II balances the thermals and acoustics of any build with a single click. A proprietary ASUS algorithm slashes unnecessary noise while running a quick stress test, and then it monitors CPU temperatures to dynamically adjust fans to optimal speeds. |
M.2 HeatsinksThree M.2 heatsinks cover four M.2 slots, warding off throttling that can occur with M.2 storage during sustained transfers.Removable captive screws reduce risk of drops or loss during heatsink removal. |
VRM Heatsinks and Thermal PadsThe extensive surface area of the massive heatsinks cover the VRMs and chokes to improve heat dissipation. Together with specially engineered thermal pads, they improve heat transfer from the MOSFETs and chokes for better cooling performance. |
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Robust Power DesignStable power is essential to extract every last bit of performance out of Intel processors. The PRIME Z790M-PLUS D4 is geared to cater to the demands of these high-core-count CPUs.1. ProCool ConnectorsProprietary connectors augment the motherboard's link to the PSU with 8+8 pin connectors that pass 12 volts of power directly to the processors. Each jack features solid pins that can handle more current than hollow-pin connectors.2. 16 + 1 Teamed Power Stages16 + 1 power stages combine high-side and low-side MOSFETS and drivers ackages rated for 60 amperes each, delivering power, efficiency, stability and performance to latest Intel processors. |
AEMP II for Ultimate DDR5 PerformanceASUS Enhanced Memory Profile II (AEMP II) is an exclusive firmware feature for PMIC-restricted memory modules. AEMP II is based on a CPU and memory module’s ability to train the memory chips on your kit, and it presents an optimized clock speed that can effortlessly unleash performance.Built through a flexible training method, AEMP II makes it easy to not only tune the memory above baseline settings but also maintain the stability of system operations, whether getting the most out of an entry-level module or priming a high-speed kit for ultimate performance. |
Four M.2 slots (up to 64 Gbps)PRIME Z790M-PLUS D4 offers a total of four M.2 slots that support data-transfer speeds of up to 64 Gbps via PCIe 4.0, enabling quicker boot-up and app load times with OS or application drives. |
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PCIe 5.0 SlotPCIe 5.0 offers twice the data transfer speed of PCIe 4.0, making it robust enough to handle new data-heavy tasks. PCIe 5.0 also brings other benefits, such as electrical changes to improve signal integrity, backward-compatible CEM connectors for add-in cards, and compatibility with previous versions of PCI Express. |
USB 3.2 Gen 2x2 Type-CA batch of USB ports support high-end rigs loaded with peripherals, including both front and rear USB Type-C connectors with ultrafast USB 3.2 Gen 2x2 for transmission speeds of up to 20 Gbps. |
WiFi 6EOnboard WiFi 6E technology takes advantage of the newly available radio spectrum in the 6 GHz band. It provides up to three times the bandwidth of the 5 GHz band and up to seven 160 MHz bands to deliver ultrafast wireless networking speeds and improved capacity as well as better performance in dense wireless environments. |
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